Enhancement of underfill physical properties by the addition of thermotropic cellulose
AssigneeDelphi Technologies, Inc.
InventorsDerek B. Workman, Arun K. Chaudhuri, David W. Ihms
Life of this patent
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Abstract
An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on a substrate circuit board, and a composite material underfilling, overmolding or encapsulating the electronic device, wherein the composite material includes a thermoset matrix phase and a discontinuous liquid crystal polymer phase dispersed throughout the thermoset matrix phase.
Claims15
An electrical component comprising:
- a substrate circuit board;
- an electronic device mounted on the substrate circuit board in spaced relationship from the substrate circuit board;
- and
- a composite material underfilling, overmolding or encapsulating the electronic device, the composite material including a continuous thermoset matrix phase and a discontinuous liquid crystalline polymer phase dispersed throughout the thermoset matrix phase, wherein the dispersed liquid crytalline polymer is in the form of particles having an average size of from about 0.2 microns to about 0.5 microns.
An electrical component comprising:
- a substrate circuit board;
- an electronic device mounted on the substrate circuit board in spaced relationship from the substrate circuit board;
- and
- a composite material underfilling, overmolding or encapsulating the electronic device, the composite material including a continuous thermoset matrix phase and a discontinuous liquid crystalline polymer phase dispersed throughout the thermoset matrix phase, wherein the dispersed liquid crystalline polymer is present in the composite material in an amount of about 10 percent by weight.
An electrical component comprising:
- a substrate circuit board;
- an electronic device mounted on the substrate circuit board in spaced relationship from the substrate circuit board;
- and
- a composite material underfilling the electronic device, the composite material including a continuous thermoset matrix phase and a discontinuous liquid crystalline polymer phase dispersed throughout the thermoset matrix phase.
Dependencies are inferred from the claim text.