Printed circuit board with isolated metallic substrate comprising an integrated cooling system
AssigneeLear Corporation
InventorsCaŕles Borrego Bel, Xavier Sanchez Foguet, Alex Subirates Sole
Life of this patent
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Abstract
Printed circuit board with insulated metal substrate with integrated cooling systemlt comprises a metal substrate (10), at least one electrically insulating layer (11) adhered to said metal substrate (10) and several electro-conducting tracks (12) capable of interconnecting electronic power components (24), adhered to said electrically insulating layer (11), said metal substrate (10) incorporating several heat transporting channels comprising several conduits for a heat-carrying fluid, conduits which extend to the outside of the metal substrate up to a heat transfer area to an outside medium.
Claims10
A printed circuit board having an insulated metal substrate with an integrated cooling system, comprising:
- a metal substrate(10);
- at least one electrically insulating layer (11) adhered to said metal substrate (10);
- and several electro-conducting tracks (12) capable of interconnecting electronic power components (24) adhered to said electrically insulating layer (11);
- wherein said metal substrate (10) incorporates at least one heat transporting cavity (13), having at least one opening (14) at one edge (19) of said metal substrate (10), said at least one heat transporting cavity (13) having located therein a conduit for a heat-carrying fluid, said conduits extending by way of said at least one opening (14) to the outside of, and upward from, said metal substrate (10) forming a sealed heat transfer area in an external heat transfer medium.
Dependencies are inferred from the claim text.