Ferroelectric capacitor devices and a method for compensating for damage to a capacitor caused by etching
AssigneeInfineon Technologies AG
InventorBum-Ki Moon
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AssigneeInfineon Technologies AG
InventorBum-Ki Moon
Estimating the term…
A ferroelectric capacitor in which damage caused by etching exposed faces of a ferroelectric layer of the capacitor is compensated by depositing a seeding layer of ferroelectric material such as PZT on one or more exposed faces of the ferroelectric layer and depositing an electrode layer made of conductive material such as platinum on the seeding layer. An oxygen annealing recovery process is applied to the device. The seeding layer can transform the phase of the damaged surfaces from amorphous to crystalline during the recovery annealing process and, at the same time, provide the damaged surfaces of the ferroelectric layer with missing element(s), for example lead. The oxygen necessary for recovery of the damage may be obtained through the platinum layer from the oxygen atmosphere.
A method for compensating for damage to a vertical capacitor caused by etching one or more exposed faces of a ferroelectric layer of the vertical capacitor, the vertical capacitor comprising of a first and second electrode with said ferroelectric layer located between said first and second electrode, the method comprising the steps of:
A method for compensating for damage to a capacitor caused by etching one or more exposed faces of a ferroelectric layer of the capacitor, the capacitor comprising of a first and second electrode with said ferroelectric layer located between said first and second electrode, the method comprising the steps of:
Dependencies are inferred from the claim text.