Method of applying adhesive
AssigneeMosel Vitelic, Inc.
InventorsMifong Wu, Chung-Chih Yeh
Life of this patent
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AssigneeMosel Vitelic, Inc.
InventorsMifong Wu, Chung-Chih Yeh
Estimating the term…
An applying method for an adhesive according to an embodiment includes the following steps. First, gas is exhausted from a first exhaust pipe, so as to eliminate a part of the gas in a closed container. Next, the gas continues to be exhausted from the first exhaust pipe, so as to have the adhesive in the transmission pipeline become bubbled, and also to convey the bubbled adhesive to reach the supply vent. Later, gas is exhausted from the second exhaust pipe and continues to be exhausted from the first exhaust pipe, so as to greatly exhaust the gas in the closed container, and also to increase bubbling in the adhesive. Subsequently, the gas continues to be exhausted from the second exhaust pipe and ceases to be exhausted from the first exhaust pipe, so as to cause the adhesive to reach a gasified state. Also the gasified adhesive is supplied to the closed container from the supply vent, so that the gasified adhesive can adhere to and coat above the SiO2 layer. Finally, gas may be exhausted from the first exhaust pipe and ceases to be exhausted from the second exhaust pipe, so that the remaining gasified adhesive in the closed container is pumped out.
An applying method for an adhesive, which is provided to apply an adhesive on a SiO2 layer of a wafer placed in an closed container, wherein the closed container is connected with a transmission pipeline by a supply vent, wherein the transmission pipeline is used for conveying the adhesive to the closed container, wherein the closed container also includes an exhaust vent, wherein the exhaust vent is externally connected with a first exhaust pipe coupled with a vacuum pump and a second exhaust pipe coupled with a gas-extracting tube, and wherein the applying method comprising:
A method of applying an adhesive on a wafer, the method comprising:
A method of applying an adhesive on a wafer, the method comprising:
Dependencies are inferred from the claim text.