Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems

A cooled electronics system comprising:

• multiple electronics subsystems;
• multiple coolant conditioning units (CCUs), each CCU of the multiple CCUs providing system coolant to a different, associated electronics subsystem of the multiple electronics subsystems;
• and
• wherein each CCU of the multiple CCUs comprises a heat exchanger, a first cooling loop with a control valve, and a second cooling loop, the first cooling loop receiving chilled facility coolant from a source and passing at least a portion thereof via the control valve through the heat exchanger, the second cooling loop providing cooled system coolant to the associated electronics subsystem, and expelling heat in the heat exchanger from the associated electronics subsystem to the chilled facility coolant in the first cooling loop, wherein the control valve allows regulation of facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop for cooling the associated electronics subsystem.

A method for cooling multiple electronics subsystems, the method comprising:

• providing multiple coolant conditioning units (CCUs), each CCU of at least some CCUs of the multiple CCUs providing system coolant to a different, associated electronics subsystem of the multiple electronics subsystems to be cooled, wherein each CCU of the at least some CCUs comprises a heat exchanger, a first cooling loop with a control valve, and a second cooling loop with system coolant;
• providing, for each CCU of the at least some CCUs, chilled facility coolant to the first cooling loop from a source and passing at least a portion thereof via the control valve through the heat exchanger;
• providing, for each CCU of the at least some CCUs, cooled system coolant within the second cooling loop to the associated electronics subsystem, and expelling heat in the heat exchanger from the associated electronics subsystem to the chilled facility coolant in the first cooling loop;
• and
• wherein the control valve of the CCU allows regulation of facility coolant flow through the heat exchanger, thereby allowing independent control of a desired temperature of the system coolant in the second cooling loop for cooling the associated electronics subsystem.