Electronic module assembly

A method for maintaining an interconnection grid array interconnecting an electronic module to a circuit board while engaging said electronic module to a heat sink comprising:

• providing an electronic module having a chip carrier and a chip mounted to a circuit board via an interconnection grid array;
• positioning a loading block having a plurality of legs at said backside of said circuit board in a location corresponding to a central area of said interconnection grid array;
• providing a spring having a central opening and a plurality of peripheral openings;
• engaging a plurality of securing means within said plurality of peripheral openings of said spring;
• engaging a fastening means within said central opening of said spring;
• positioning said spring under said loading block such that said fastening means is centrally aligned with said loading block and said plurality of securing means are aligned with and traverse through corresponding openings in said circuit board;
• applying pressure simultaneously to said loading block and said spring by actuating said fastening means,
• whereby said pressure on said loading block forces said plurality of legs of said loading block against said circuit board to generate central backside compressive forces directed at said central area of said interconnection grid array, while said pressures on said spring are transferred to said plurality of securing means to engage said plurality of securing means within said heat sink for coupling said heat sink to said chip, thereby maintaining integrity of said interconnection grid array.

A clamping assembly for engaging an electronic module to another structure comprising:

• an electronic module mounted to a circuit board via an interconnection grid array;
• a loading block having a plurality of legs, said loading block positioned at a backside of said electronic module, toward said circuit board, in a location corresponding to a central area of said interconnection grid array;
• a spring having a central opening and a plurality of peripheral openings equidistant from said central opening, said spring being adjacent said loading block without contacting said electronic module or said circuit board;
• a plurality of securing means engaged within said plurality of peripheral openings of said spring;
• and
• a fastening means engaged within said central opening of said spring, said fastening means being centrally aligned with and in contact with said loading block, whereupon said assembly generates central backside compressive forces that direct said loading block against said circuit board in said location corresponding to said central area of said interconnection grid array such that integrity of said interconnection grid array is maintained, while said plurality of securing means engage said electronic module to said another structure.