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US 7,095,098 B2Granted
Electrically isolated and thermally conductive double-sided pre-packaged component
AssigneeDelphi Technologies, Inc.
InventorsErich William Gerbsch, Ralph S. Taylor
Life of this patent
Estimating the term…
Abstract
An electrically isolated and thermally conductive double-sided pre-packaged IC component, stamped lead members, drain pads, source pads, gate runner, and a MOSFET, IGBT, etc. are positioned between a pair of ceramic substrate members. Layers of solderable copper material are directly bonded to the inner and outer surfaces of the substrate members.
Claims5
A pre-packaged component device comprising:
- a first non-conductive substrate member having an outer surface;
- a second non-conductive substrate member having an outer surface, said first and second substrate members being formed from a ceramic material and disposed in a spaced, substantially parallel relationship, with said surfaces opposing one another;
- a first layer of solderable electrically conductive copper material direct bonded to the outer surface of said first substrate member;
- a second layer of solderable electrically conductive copper material direct bonded to the outer surface of said second substrate member;
- lead members and a metal oxide semiconductor field effect transistor (MOSFET) positioned between said first and second non-conductive substrate members, said MOSFET having at least one gate, said lead members stamped from copper material during manufacture and comprising a gate pin, a drain member and a source member;
- a drain pad positioned on an inside surface of said first non-conductive substrate member facing said second non-conductive substrate member;
- a source pad and a gate runner positioned on an inside surface of said second non-conductive substrate member facing said first non-conductive substrate member.
4 more elements
Dependencies are inferred from the claim text.