Semiconductor sensor with pressure difference adjusting means
AssigneeDenso Corporation
InventorKazuaki Hamamoto
Life of this patent
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Abstract
In a semiconductor sensor having a membrane structure, the destruction of the membrane caused by the expansion or contraction of a fluid within a hollow part formed under the membrane while the sensor is in use is prevented. A semiconductor sensor 10 comprising a substrate 30 and a membrane 20 formed on the top surface thereof, in which the bottom of the substrate 30 and a mounting surface 50 on which the sensor 10 is mounted are bonded, has pressure difference adjusting means 22a to 22c for eliminating the difference in pressure of a fluid between an inside and an outside of a hollow part 34 while the sensor is in use.
Claims13
A semiconductor sensor comprising:
- a substrate;
- a membrane which is a thin part formed on a top surface of the substrate;
- and
- a thick portion which is formed in a portion excluding the thin portion from the substrate;
- wherein
- a hollow part is formed under the membrane by bonding a bottom of the substrate and a mounting surface on which the semiconductor sensor is mounted;
- a pressure difference adjusting means is provided for eliminating difference in pressure of a fluid between an inside and an outside of the hollow part while the sensor is in use;
- and
- the pressure difference adjusting means is at least a relief hole, provided on the membrane, for the expansion or contraction of a fluid within the hollow part, only the at least a relief hole communicating the hollow part to an outside of the semiconductor sensor.
A semiconductor sensor comprising:
- a substrate;
- a membrane which is a thin part formed on a top surface of the substrate;
- and
- a thick portion which is formed in a portion excluding the thin portion from the substrate;
- wherein
- a hollow part is formed under the membrane by bonding a bottom of the substrate and a mounting surface on which the semiconductor sensor is mounted, the entire undersurface of the substrate being bonded to the mounting surface to enclose the hollow part;
- at least a relief hole is provided on the membrane for eliminating difference in pressure of a fluid between an inside and an outside of the hollow part while the sensor is in use, the at least a relief hole being provided on the membrane, for the expansion or contraction of a fluid within the hollow part, only the at least a relief hole communicating the hollow part to an outside of the semiconductor sensor,
- wherein the semiconductor sensor is any one of an infrared-ray sensor, a gas sensor, an air fuel ratio sensor, a pressure sensor and an acceleration sensor.
Dependencies are inferred from the claim text.