Apparatus and method for heating and cooling an article

An apparatus designed to process semi-conductor wafers comprising:

• an enclosure having top, bottom, and side walls and an entrance and an exit, wherein at least a portion of the top, bottom and/or side walls comprise porous insulation;
• a first belt system comprising one or more belts extending from a loading position outside the enclosure, through the entrance of the enclosure and through a portion of the enclosure, the first belt system having a loading end and an unloading end, at least one of the belts of the first belt system having a tight weave mesh;
• a second belt system comprising one or more belts extending from the unloading end of the first belt system and through the exit of the enclosure to an unloading position outside the enclosure, the second belt system having a loading end and an unloading end, at least one of the belts of the second belt system having a loose mesh weave;
• and
• one or more heating sources positioned below the first belt system for heating the first belt system.