Optical interconnection circuit board and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorHideto Furuyama
Life of this patent
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Abstract
In an optical connection board, a first clad layer is formed on a flat surface of a substrate and a core layer is formed on the first clad layer and is extended in a propagation direction of an optical signal. The core layer is covered with a second clad layer. A termination mirror having a reflection face is so buried in the clad layer as to reflect the optical signal guided in the core layer, to the outside of the optical connection board.
Claims10
An optical interconnection circuit board for changing an optical path of an optical signal, comprising:
- a substrate having a surface;
- a first clad layer being a flat surface, which is formed on the surface of the substrate;
- a first core segment configured to guide the optical signal in a first predetermined direction, formed on the flat surface of the first clad layer and extended in the first predetermined direction;
- a second core segment configured to guide the optical signal in a second predetermined direction, different from the first predetermined direction, formed on the flat surface of the first clad layer and extended in the second predetermined direction;
- an optical coupling mirror configured to optically couple the first core segment to the second core segment, the optical signal guided in the first core segment being reflected from the optical coupling mirror, the optical coupling mirror being formed on the flat surface of the first clad layer and contacted to the first and second core segments, and extending in a third predetermined direction different from the first and second directions;
- a second clad layer formed on the first and second core segments and the optical coupling mirror;
- and
- a reflection layer formed on the second clad layer, configured to reflect the optical signal from the optical coupling mirror and redirect the optical signal to the optical coupling mirror through the second clad layer, the redirected optical signal being reflected from the optical coupling mirror into the second core segment and propagated in the second core segment.
A method of manufacturing an optical interconnection circuit board for guiding an optical signal, comprising:
- preparing a substrate having a surface;
- forming a first clad layer having a flat surface, on the surface of the substrate;
- forming a mirror layer on the first clad layer;
- etching the mirror layer to form a mirror segment having a reflection face thereon and having a first height;
- forming a first core segment on the first clad layer, the core segment having a second height not greater than the first height and being so extended as to have a predetermined optical circuit pattern;
- covering the first core segment with a second clad layer;
- and
- forming a reflection layer on the second clad layer.
A method of manufacturing an optical interconnection circuit board for guiding an optical signal, comprising:
- preparing a substrate having a surface;
- forming a first clad layer having a flat surface, on the surface of the substrate;
- forming a mask layer on the first clad layer, the mask layer having an opening region;
- depositing a mirror layer on the first clad layer under the opening region of the mask layer to form a mirror on the first clad layer, the mirror having a reflection face thereon and having a first height;
- forming a first core segment on the first clad layer, the first core segment having a second height not greater than the first height and being so extended as to have a predetermined optical circuit pattern;
- covering the first core segment with a second clad layer;
- and
- forming a reflection layer on the second clad layer.
Dependencies are inferred from the claim text.