Programmable MOS device formed by stressing polycrystalline silicon
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Hui Chen, Shun-Liang Hsu, Yean-Kuen Fang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Hui Chen, Shun-Liang Hsu, Yean-Kuen Fang
Estimating the term…
A programmable memory circuit and a method for programming the same are disclosed. A polycrystalline silicon resistor pair are used in a programmable memory cell. The pair includes a first polycrystalline silicon resistor stressable by a predetermined current thereacross, and a second polycrystalline silicon resistor similarly structured as the first polycrystalline silicon resistor stressable by the predetermined current, wherein when only the first resistor is stressed by the predetermined current, a resistance of the first resistor is lowered as compared to the unstressed second resistor, thereby programming the memory cell.
A programmable metal-oxide-semiconductor (MOS) memory circuit comprising:
A method for programming a metal-oxide-semiconductor (MOS) memory circuit, the circuit comprising a data read module having a first input and a second input and one or more outputs, a first and second polycrystalline resistors having their first ends connectable to a first control voltage level and their second end connected to a second voltage level, and a connection module for connecting the first ends of the first and second resistors to the first and second inputs respectively, the method comprising:
A programmable metal-oxide-semiconductor (MOS) memory circuit comprising:
A polycrystalline silicon resistor pair used in a programmable memory cell comprising:
Dependencies are inferred from the claim text.