Memory module cooling
AssigneeSun Microsystems, Inc.
InventorsWilliam George Gates, Richard John Harris, Sean Conor Wrycraft
Life of this patent
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Abstract
A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.
Claims37
A heatsink for a memory module, the heatsink comprising:
- a pair of mutually opposing, substantially planar contact portions for forming a thermal contact with the memory module and for mounting the heatsink on the memory module;
- and
- a pair of mutually opposing formations for emitting heat, each of the formations for emitting heat being in thermal communication with at least one of the contact portions and comprising two or more folds, the formations being coupled with one another at two or more junctions, at least one of the junctions being between two of the folds.
An assembly comprising a memory module and a heatsink, the heatsink being mounted on the memory module and comprising:
- a pair of mutually opposing, substantially planar contact portions forming a thermal contact with the memory module;
- and
- a pair of mutually opposing formations for emitting heat, each of the formations for emitting heat being in thermal communication with at least one of the contact portions and comprising two or more folds, the formations being coupled with one another at two or more junctions, at least one of the junctions being between two of the folds.
Apparatus comprising a circuit board and a memory module and heatsink assembly, wherein:
- the memory module is mounted on the circuit board;
- and
- the heatsink is mounted on the memory module and comprises:
- a pair of mutually opposing, substantially planar contact portions forming a thermal contact with the memory module;
- and
- a pair of mutually opposing formations for emitting heat, each of the formations for emitting heat being in thermal communication with at least one of the contact portions and comprising two or more folds, the formations being coupled with one another at two or more junctions, at least one of the junctions being between two of the folds.
A computer system comprising a circuit board and a memory module and heatsink assembly, wherein:
- the memory module is mounted on the circuit board;
- and
- the heatsink is mounted on the memory module and comprises:
- a pair of mutually opposing, substantially planar contact portions forming a thermal contact with the memory module;
- and
- a pair of mutually opposing formations for emitting heat, each of the formations for emitting heat being in thermal communication with at least one of the contact portions and comprising two or more folds, the formations being coupled with one another at two or more junctions, at least one of the junctions being between two of the folds.
A method for cooling a memory module, the method comprising providing heatsink comprising:
- a pair of mutually opposing, substantially planar contact portions for forming a thermal contact with the memory module and for mounting the heatsink on the memory module;
- and
- a pair of mutually opposing formations for emitting heat, each of the formations for emitting heat being in thermal communication with the contact portions;
- and mounting the heatsink on the memory module and comprising two or more folds, the formations being coupled with one another at two or more junctions, at least one of the junctions being between two of the folds.
Dependencies are inferred from the claim text.