Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device
AssigneeShinko Electric Industries Co., Ltd.
InventorTomoo Yamasaki
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Abstract
In a capacitor device of the present invention includes a substrate, a plurality of lower electrodes formed on the substrate, a plurality of dielectric films formed on a plurality of lower electrodes respectively in a state that the dielectric films are separated mutually, and upper electrodes formed on a plurality of dielectric films respectively, a plurality of capacitors each composed of the lower electrode, the dielectric film, and the upper electrode are arranged on the substrate respectively, and each of the dielectric films in a plurality of capacitors has a different film thickness.
Claims11
A capacitor device comprising:
- a substrate;
- a plurality of lower electrodes formed directly on an identical surface of the substrate;
- a plurality of dielectric films formed on the plurality of lower electrodes respectively in a state that the dielectric films are separated mutually;
- and
- upper electrodes formed on the plurality of dielectric films respectively;
- wherein a plurality of capacitors each composed of the lower electrode, the dielectric film, and the upper electrode are arranged on the substrate as one chip, and each of the dielectric films in the plurality of capacitors has a different film thickness, thereby electrostatic capacities of respective capacitors are different.
Dependencies are inferred from the claim text.