Additive-process suspension interconnect with controlled noise

A method of fabricating a disk drive suspension interconnect assembly, including providing a supporting fifth layer, depositing onto said fifth layer a fourth layer comprising a polyimide precursor, converting said fourth layer to polyimide having a first face directed away from said fifth layer, forming a third layer comprising a first subset of one or more conductive trace pair members directly attached to said first face, depositing onto said fourth and third layers a second layer comprising a polyimide precursor and converting said second layer to polyimide having a second face directed away from said third layer, forming a first layer comprising a second subset of one or more conductive trace pair members directly attached to said second face in spaced, paired and laterally offset relation respectively with said one or more first subset pair members, and removing said fifth supporting layer.

A disk drive suspension electrical interconnect assembly adapted to be supported on a disk drive suspension load beam, said interconnect assembly comprising a fifth layer comprising metal, a fourth layer on said fifth layer, said fourth layer comprising a polyimide precursor or a polyimide, said fourth layer having a first face directed away from said fifth layer, a third layer directly attached to said first face, said third layer comprising a first subset of one or more conductive trace pair members, a second layer on said third and fourth layers, said second layer comprising a polyimide precursor or a polyimide, said second layer having a second face directed away from said third layer, and a first layer directly attached to said second layer, said first layer comprising a second subset of one or more conductive trace pair members in spaced, paired, laterally offset and overlapping relation with their centerlines offset respectively with said one or more first subset pair members.

A disk drive suspension electrical interconnect assembly adapted to be supported on a disk drive suspension load beam, said interconnect assembly comprising a fourth layer, said fourth layer comprising a polyimide precursor or a polyimide, said fourth layer having a first face, a third layer directly attached to said first face, said third layer comprising a first subset of one or more conductive trace pair members, a second layer on said third and fourth layers, said second layer comprising a polyimide precursor or a polyimide, said second layer having a second face, and a first layer directly attached to said second layer, said first layer comprising a second subset of one or more conductive trace pair members in spaced, paired, laterally offset and overlapping relation with their centerlines offset respectively with said one or more first subset pair members.