Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment

An electronic testing system comprising:

• at least one circuit board, each circuit board having a first outer face at an end and on one side of the circuit board, a second outer face at the end and on the other side of the circuit board, first contacts arranged on at least one of the first and second outer faces, and at least one first mechanical alignment feature;
• and
• at least one clamping assembly corresponding to each circuit board, each clamping assembly including a first assembly having a first inner face, a second assembly having a second inner face substantially parallel to the first inner face over an entirety of the first and second inner faces, a second plurality of contacts arranged on at least one of the first and second inner faces, and at least one second mechanical alignment feature operable in conjunction with the at least one first mechanical alignment feature on the corresponding circuit board to facilitate alignment of the second contacts with the first contacts;
• wherein the first and second assemblies of each clamping assembly are configured to enable relative motion between the entirety of each of the first and second inner faces to effect clamping of the first and second inner faces to the first and second outer faces of the corresponding circuit board thereby electrically connecting the first and second contacts.