Back to results
US 7,078,821 B2Granted
Ball film for integrated circuit fabrication and testing
AssigneeTexas Instruments Incorporated
InventorAkira Matsunami
Life of this patent
Estimating the term…
Abstract
According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal balls to the substrate, and removing the thin film from the metal balls.
Claims7
A ball film for fabricating and/or testing integrated circuits, comprising:
- a thin film having a front side and a back side comprising a plurality of slots;
- each slot having a opening having a first diameter on the front side and a opening with a second diameter on the back side of the thin film, a side wall including a portion of a sphere with a diameter greater than the first and the second diameter;
- and
- a plurality of metal balls each movably contained within a respective one of the plurality of slots;
- each ball having a diameter greater than the first and the second diameter of the slot containing the ball.
2 more elements
Dependencies are inferred from the claim text.