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US 7,078,819 B2Granted
Microelectronic packages with elongated solder interconnections
AssigneeTessera, Inc.
InventorThomas H. DiStefano
Life of this patent
Estimating the term…
Abstract
A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.
Claims6
A soldered assembly comprising:
- (a) first and second elements having confronting surfaces, pads on said confronting elements arranged in pairs, each such pair including a pad on the first element and a pad on the second element;
- and
- (b) solder masses associated with at least some of said pairs, each such solder mass being associated with the pads of one said pair and extending therebetween, said solder masses incorporating columnar inclusions dispersed therein, said columnar inclusions within at least one of said solder masses being oriented preferentially in the direction between the pads of the associated pair.
A soldered assembly comprising;
- (a) first and second elements having confronting surfaces, pads on said confronting elements arranged in pairs, each such pair including a pad on the first element and a pad on the second element;
- and
- (b) solder masses at at least some of said pairs, each such solder mass being associated with the pads of one said pair and extending therebetween, each said solder mass being elongated in the direction between the pads of the associated pair, the pads of each said pair being spaced apart from one another in a vertical direction normal to the confronting surfaces, the pad of each said pair on said first element being offset from the pad of that pair on the second element in a horizontal offset direction parallel to the confronting surfaces so that said elongated solder masses extend oblique to said vertical and horizontal directions, said offset directions of all of said pairs being the same so that all of said elongated solder masses slope in the same direction.
Dependencies are inferred from the claim text.