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AssigneeInternational Business Machines Corporation
InventorsMichael Gaynes, William R. Hill
Estimating the term…
A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).
A method of marking a dielectric material of an electronic package wherein said dielectric material has a surface with a quantity of silicone oil or other silicone residue thereon and said marking involves the deposition of a predetermined pattern of ink onto said surface, the improvement comprising roughening said surface of said dielectric material and exposing said surface of said dielectric material to a plasma prior to converting substantially all of said silicon containing residues or silicone oil to silica prior to said deposition of said predetermined pattern of ink.
An electronic package comprising:
Dependencies are inferred from the claim text.