Thermoelectric module package

A thermoelectric module package for storing a thermoelectric module performing temperature control on a semiconductor element, comprising:

• a package body integrally constituted by a frame and a base,
• wherein the package body is equipped with a plurality of internal electrodes for establishing electric connections with the semiconductor element and the thermoelectric module, a plurality of external electrodes for establishing electric connections with an external circuit, and wiring interconnecting together the internal electrodes and the external electrodes, and
• the external electrodes are formed only on the base member, and the electric connections are realized only on the base member, wherein both the electrodes for inputting and outputting currents with the external circuit are arranged on the base member.

A thermoelectric module package for storing a thermoelectric module performing temperature control on a semiconductor element, comprising:

• a package body integrally constituted by a frame and a base,
• the package body is equipped with a plurality of internal electrodes for establishing electric connections with the semiconductor element and the thermoelectric module, a plurality of external electrodes for establishing electric connections with an external circuit, and wiring interconnecting together the internal electrodes and the external electrodes and the package body is constituted by a multilayer substrate in which the wiring interconnecting together the internal electrodes and the external electrodes is embedded.

A thermoelectric module package for storing a thermoelectric module performing temperature control on a semiconductor element, comprising:

• a package body integrally constituted by a frame and a base,
• wherein the package body is equipped with a plurality of internal electrodes for establishing electric connections with the semiconductor element and the thermoelectric module, a plurality of external electrodes for establishing electric connections with an external circuit, and wiring interconnecting together the internal electrodes and the external electrodes and the plurality of internal electrodes are formed on a surface of the base of the package body, and the plurality of external electrodes are formed on a backside of the base of the package body, and wherein a plurality of conductors interconnecting together the internal electrodes and the external electrodes are embedded in the base of the package body.

A thermoelectric module package for storing a thermoelectric module performing temperature control on a semiconductor element, comprising:

• a package body integrally constituted by a frame and a base,
• wherein the package body is equipped with a plurality of internal electrodes for establishing electric connections with the semiconductor element and the thermoelectric module, a plurality of external electrodes for establishing electric connections with an external circuit, and wiring interconnecting together the internal electrodes and the external electrodes and the plurality of internal electrodes are formed on a surface of the base of the package body, and the plurality of external electrodes are formed on an external side area of the frame of the package body, and wherein a plurality of conductors interconnecting together the internal electrodes and the external electrodes are embedded in the base and/or the frame of the package body.