Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
AssigneeRambus Inc.
InventorBelgacem Haba
Life of this patent
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Abstract
Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Individual substrates are stacked together in a die stack such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate. In a preferred embodiment, the conductive structures comprise multi-layered, conductive pad structures.
Claims24
A semiconductor device comprising:
- a first semiconductor die having opposing first and second sides, the first semiconductor die comprising:
- at least two first integrated circuit devices;
- a first conductive structure electrically coupled between the at least two first integrated circuit devices, where the first conductive structure is disposed at least partially through the first semiconductor die and exposed at the first side of the first semiconductor die;
- a second semiconductor die having opposing first and second sides, the second semiconductor die comprising:
- at least two second integrated circuit devices;
- a second conductive structure electrically coupled between the at least two second integrated circuit devices, where the second conductive structure is disposed at least partially through the second semiconductor die and exposed at the second side of the second semiconductor die,
- wherein the first semiconductor die is stacked on top of the second semiconductor die such that the first conductive structure at the first side of the first integrated circuit die is aligned with, and electrically coupled to, the second conductive structure at the second side of the second semiconductor die.
A semiconductor device comprising:
- multiple semiconductor dies each comprising:
- at least two integrated circuit devices;
- a conductive structure electrically coupled to the at least two integrated circuit devices, where the conductive structure is disposed at least partially through the semiconductor die and exposed at one side of the semiconductor die at a location other than near a periphery of the semiconductor die,
- wherein the multiple semiconductor dies are stacked on top of each other such that their respective conductive structures are aligned with, and are electrically coupled to, each other.
A method of forming a semiconductor device comprising:
- forming a first semiconductor die having opposing first and second sides, the first semiconductor die comprising:
- at least two first integrated circuit devices;
- a first conductive structure electrically coupled between the at least two first integrated circuit devices, where the first conductive structure is disposed at least partially through the first semiconductor die and exposed at the first side of the first semiconductor die;
- forming a second semiconductor die having opposing first and second sides, the second semiconductor die comprising:
- at least two second integrated circuit devices;
- a second conductive structure electrically coupled between the at least two second integrated circuit devices, where the second conductive structure is disposed at least partially through the second semiconductor die and exposed at the second side of the second semiconductor die;
- stacking the first semiconductor die on the second semiconductor die such that the first conductive structure at the first side of the first integrated circuit die is aligned with the second conductive structure at the second side of the second semiconductor die;
- and
- electrically coupling the first conductive structure to the second conductive structure.
Dependencies are inferred from the claim text.