US 7,078,789 B2 · Method of forming a metal film, semiconductor device and wiring board

Abstract

A method of forming a metal film on the surface of a resin substrate by forming plating nuclei on a resin substrate through a step of catalyzing treatment, a step of accelerating treatment and, then, a step of electrolytic copper plating treatment. Ultraviolet light is irradiated when there exist, in a mixed manner, portions exposing the surface of the resin substrate and the metal copper film formed by the electroless copper plating, to enhance the adhesion between the surface of the resin and the metal copper film. A step of ultraviolet light irradiation treatment is conducted after a step of electroless copper plating treatment. This is followed by an additional step of electroless copper plating treatment.

Claims4

Dependent claims

A method of forming a metal film on a resin substrate surface, comprising, in succession:

forming plating nuclei on said resin substrate surface;
electroless plating said plating nuclei with a metal covering said plating nuclei, as a first surface, portions of the resin substrate surface remaining exposed, as a second surface;
after said electroless plating, irradiating both said first surface and said second surface with ultraviolet light;
and
electrolytic plating metal on said first and second surfaces to form a continuous metal film surface.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/732,259Filed 11 Dec 2003

Priority

JP 2002-36068612 Dec 2002

Published

US 2004/0121595 A124 Jun 2004

Granted

18 Jul 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

C23C 18/30
Sensitising or activating: activating or accelerating or sensitising with palladium or other noble metal
C23C 18/1608
By direct patterning: from pretreatment step, i.e. selective pre-treatment
C23C 18/1653
Multilayered product: two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/1667
With additional means during the plating process: radiant energy, e.g. laser

Method of forming a metal film, semiconductor device and wiring board

Life of this patent

Method of forming a metal film, semiconductor device and wiring board

Life of this patent

Abstract

Claims4