Sealing of electronic device using absorbing layer for glue line

A method to encapsulate an organic electronic device, comprising:

• fabricating said organic electronic device on a substrate;
• optionally depositing a first absorbing layer on any one of:
• (1) said substrate or (2) said encapsulation cover;
• depositing a heat-activated adhesive on any one of:
• (1) said first absorbing layer, (2) said substrate, or (3) said encapsulation cover;
• optionally depositing a second absorbing layer on any one of:
• (1) said heat-activated adhesive, (2) said substrate, or (3) said encapsulation cover;
• bringing together said substrate and said encapsulation cover such that said first absorbing layer if present, said heat-activated adhesive, second absorbing layer if present, said substrate, and said encapsulation cover contact each other to seal said organic electronic device and form an encapsulated organic electronic device, wherein the heat-activated adhesive surrounds a perimeter of said organic electronic device, one of the first absorbing layer is between said substrate and said heat-activated adhesive or said second absorbing layer is between is between said encapsulation cover and said heat-activated adhesive and in proximity to said heat-activated adhesive;
• and
• applying IR radiation to said heat-activated adhesive to cure said heat-activated adhesive,
• wherein at least one of:
• (1) said first absorbing layer is deposited, or(2) said second absorbing layer is deposited, and
• wherein if an IR source that supplies the IR radiation is on a substrate-side of the encapsulated organic electronic device during the step of applying IR radiation, then an IR radiation absorption percentage of said substrate is less than an absorption percentage of said first absorbing layer if present and less than an absorption percentage of said second absorbing layer if present;
• and
• if an IR source that supplies IR radiation is on an encapsulation cover-side of the encapsulated organic electronic device during the step of applying IR radiation, then an absorption percentage of said encapsulation cover is less than an absorption percentage of said first absorbing layer if present and less than an absorption percentage of said second absorbing layer if present.