Multilayer wiring board

A multilayer wiring board with a semiconductor chip mounted thereon, comprising:

• an insulating layer;
• a plurality of electrode pads on said insulating layer;
• a solder resist covering said insulating layer and said electrode pads;
• openings provided in said solder resist covering said electrode pads, each of said openings reaching a surface of the electrode pad;
• the semiconductor chip having a plurality of electrodes each arranged to correspond to an associated one of said electrode pads;
• and
• solder joints filling said openings, respectively, each of said solder joints connecting the corresponding one of said electrode pads to the corresponding one of said electrodes of said semiconductor chip,
• wherein each of the electrode pads corresponding to the electrodes located near an outer periphery of said semiconductor chip has an oblong shape,
• each of the openings of said solder resist is smaller than said oblong shape, and
• a center of said opening has a fixed location with respect to a center of said oblong shape so as to be offset from the center of said oblong shape in a direction toward a center of said semiconductor chip, said solder joints correspondingly have a fixed location with respect to the center of said oblong shape so as to be offset from the center of said oblong shape in a direction toward the center of said semiconductor chip.