Leadframe-to-plastic lock for IC package
AssigneeTexas Instruments Incorporated
InventorRichard L. Mahle
Life of this patent
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Abstract
Disclosed is a method of making a mold lock for bonding leadframe-to-plastic in an IC package. Steps include providing niches from opposing sides of the leadframe. The opposing niches are arranged such that an aperture and a mechanical key are formed within the leadframe material by the partial intersection of the niches. The key is encapsulated with mold compound to form a lock. An IC package mold lock in a leadframe is also disclosed, the lock having an aperture, a key, and mold compound encapsulating the key. Additionally, an IC package employing the leadframe-to-plastic lock is disclosed.
Claims7
A method of making an IC package mold lock comprising the steps of:
- providing a first niche in a leadframe surface;
- providing an opposing niche in an opposing leadframe surface, the opposing niche partially intersecting with the first niche with a step having an abrupt intersection portion such that an aperture in the leadframe is defined by the intersecting portions, and such that a key is defined by the nonintersecting portions;
- and
- encapsulating the key with mold compound to form a mold lock.
Dependencies are inferred from the claim text.