Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

A method for fabricating a semiconductor component on a semiconductor substrate having a first side, a second side, and a contact on the first side comprising:

• forming an opening in the contact extending at least part way into the substrate to a depth;
• forming a conductive member in the opening in electrical communication with the contact;
• thinning the substrate from the second side to a thickness less than the depth to expose a terminal portion of the conductive member as a pin contact;
• forming a conductor on the first side in electrical communication with the conductive member and a second contact on the first side in electrical communication with the conductor;
• and
• testing the component following the thinning step using the terminal portion as an electrical connection point.

A method for fabricating a plurality of semiconductor components from a semiconductor substrate having a circuit side, a back side, a plurality of semiconductor dice on the circuit side, and a plurality of die contacts on the dice, the method comprising;

• forming openings in the die contacts and part way through the substrate;
• forming conductive members in the openings in electrical contact with the die contacts;
• thinning the substrate from the back side to expose portions of the conductive members;
• and
• testing the dice following the thinning step using the portions as electrical connection points.