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US 7,078,240 B2Granted
Reliable adhesion layer interface structure for polymer memory electrode and method of making same
AssigneeIntel Corporation
InventorsJian Li, Xiao-Chun Mu
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Abstract
A polymer memory device include two organic adhesion layers that facilitate an integral package comprising a lower and an upper electrode and the ferroelectric polymer memory structure. The ferroelectric polymer memory structure includes crystalline ferroelectric polymer layers such as single and co-polymer compositions. The structure includes spin-on and/or Langmuir-Blodgett deposited compositions. A memory system allows the polymer memory device to interface with various existing hosts.
Claims9
A process of making a storage device comprising:
- forming a first electrode disposed on a substrate;
- forming a first organic adhesion layer disposed over the substrate and over the first electrode;
- forming a ferroelectric polymer structure disposed above and on the first organic adhesion layer by forming a first crystalline ferroelectric polymer layer over the first organic adhesion layer, forming a spin-on ferroelectric polymer layer over the first crystalline ferroelectric polymer layer and forming a second crystalline ferroelectric polymer layer over the spin-on polymer layer;
- forming a second organic adhesion layer disposed above and on the ferroelectric polymer structure;
- forming a second electrode disposed over the second organic adhesion layer.
2 more elements
Dependencies are inferred from the claim text.