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AssigneeHitachi Chemical Company, Ltd.
InventorsTomoaki Aoki, Taku Kawaguchi, Tatsuya Ichikawa
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A photosensitive element comprising a support film and a photosensitive resin layer formed on the support film is provided, wherein the support film is a multilayer support film comprising at least three layers; and wherein the photosensitive resin layer comprises a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule, and (C) a photopolymerization initiator. Also provided are a method of forming a resist pattern comprising the steps of laminating such a photosensitive element onto a circuit-forming substrate such that the photosensitive resin layer comes into close contact therewith; forming an exposure part by irradiating a predetermined part of the photosensitive resin layer with an active light beam; and then eliminating a part other than the exposure part; and a method of making a printed circuit board comprising the step of etching or plating the circuit-forming substrate formed with a resist pattern by this method of forming a resist pattern.
A photosensitive element comprising a support film and a photosensitive resin layer formed on said support film;
A photosensitive element an average particle size which is 0.1 to 10 times the layer thickness of said outermost layer.
A photosensitive element comprising a support film and a photosensitive resin layer formed on the support film;
A photosensitive element comprising a support film and a photosensitive resin layer formed on the support film;
Dependencies are inferred from the claim text.