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US 7,078,095 B2Granted
Adhesive film exhibiting anisotropic electrical conductivity
AssigneeXerox Corporation
InventorMan C. Tam
Life of this patent
Estimating the term…
Abstract
An anisotropic conductive film includes a release layer, an insulating adhesive matrix on the release layer, and conductive particles distributed in the matrix in a substantially uniform pattern. The film may also include a patterned adhesive layer on the release layer, so that the particles are positioned in a pattern that substantially corresponds to the pattern of the patterned adhesive layer.
Claims16
An anisotropic conductive film, comprising:
- a release layer;
- a patterned adhesive layer located on the release layer, wherein, the patterned adhesive layer comprises a pattern of raised adhesive elements that project from the release layer;
- a plurality of conductive particles, wherein the plurality of conductive particles are positioned in a pattern that corresponds to the raised adhesive elements of the patterned adhesive layer, and wherein the raised adhesive elements have a width that is between about 5% and about 50% of the width of the conductive particles;
- and
- an insulating adhesive matrix applied on the plurality of conductive particles and on the release layer.
2 more elements
An anisotropic conductive film, comprising:
- a release layer;
- a patterned adhesive layer located on the release layer, wherein, the patterned adhesive layer comprises a pattern of raised adhesive elements that project from the release layer;
- a plurality of conductive particles, wherein the plurality of conductive particles are positioned in a monolayer that corresponds to the pattern of raised adhesive elements of the patterned adhesive layer, and wherein the raised adhesive elements have a width that is between about 5% and about 50% of the width of the conductive particles;
- and
- an insulating adhesive matrix applied on the plurality of conductive particles and on the release layer.
2 more elements
An anisotropic conductive film, comprising:
- a release layer;
- a patterned adhesive layer located on the release layer, wherein the patterned adhesive layer comprises a pattern of raised adhesive elements that project from the release layer;
- a plurality of conductive particles, wherein the plurality of conductive particles are positioned in a pattern that corresponds to the raised adhesive elements of the patterned adhesive layer, and wherein the raised adhesive elements have a width that is between about 5% and about 50% of the width of the conductive particles;
- and
- an insulating adhesive matrix applied on the plurality of conductive particles and on the release layer, wherein at least one of the patterned adhesive layer and the matrix comprises at least one of a pressure-sensitive adhesive, a heat-activated adhesive, and a light-activated activated adhesive.
2 more elements
Dependencies are inferred from the claim text.