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US 7,077,731 B1Granted
Chemical mechanical planarization (CMP) system and method for preparing a wafer in a cleaning module
AssigneeLam Research Corporation
InventorXiuhua Zhang
Life of this patent
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Abstract
A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the surface of the wafer. Subsequently, a cleaning operation is conducted in the cleaning module. A CMP pad and a CMP system also are described.
Claims9
A chemical mechanical planarization (CMP) system, comprising:
- a first brush having a CMP pad covering an outer portion of the first brush;
- a second brush, the second brush being oriented relative to the first brush to receive a wafer between the first and second brushes;
- a first drive roller;
- a second drive roller, the first and second drive rollers being configured to receive an edge of the wafer to stabilize and rotate the wafer when placed between the first and second brushes;
- and
- a slurry dispenser disposed above the two drive rollers, the slurry dispenser being configured to dispense slurry onto the surface of the wafer.
3 more elements
Dependencies are inferred from the claim text.