Lead-frame for semiconductor devices
AssigneesSTMicroelectronics S.r.l., STMicroelectronics SDN BHD
InventorsAndrea Giovanni Cigada, Phui Phoong Chuang
Life of this patent
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Abstract
A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and lower surface of the frame, wherein the frame provides a through hole positioned at the outlet of the air vent so that, when the resin has solidified, it forms a flash which is in coherence with the surface of the frame.
Claims28
A structure comprising:
- a frame;
- and
- a mold having at least one air vent from which the resin can seep out of during the injecting phase into said mold, said air vent being positioned between an upper and a lower surface of said frame, wherein said frame includes:
- a through hole placed adjacent to an outlet of said air vent so that when the resin has solidified it forms a flash which is in coherence with one of the upper and lower surfaces of said frame.
An integrated circuit package, comprising:
- a semiconductor device;
- a molded portion formed around the semiconductor device and having an injection area through which resin was injected to form the molded portion, a flashing portion of molded material extruded from a vent area of the molded portion, the vent area being spaced apart from the injection area;
- and
- a lead-frame external to the molded portion and having a hole adjacent to the vent area of the molded portion, the flashing portion at least partially filling the hole.
A semiconductor lead-frame for an integrated circuit having a molded portion formed thereover, the molded portion having one or more flashing portions formed at peripheral extrusion areas thereof, the lead-frame comprising:
- a conductive skeleton having a support surface and a plurality of conductive strips on the surface, the conductive strips defining an air vent zone of the surface that is structured for placement adjacent to one of the peripheral extrusion areas, the air vent zone including a hole in the surface for receiving a portion of one of the flashing portions.
Dependencies are inferred from the claim text.