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US 7,071,548 B2Granted
Semiconductor coated with a mixture containing an adhesion promoter
AssigneeHewlett-Packard Development Company, L.P.
InventorsAlbert Hua Jeans, Ping Mei
Life of this patent
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Abstract
An article comprises a semiconductor substrate and a coating mixture on the semiconductor substrate. The coating mixture Is comprised of adhesion promoter and photopolymer. The adhesion promoter contains α-amino propyltriethoxysilane in organic solution.
Claims4
An article comprising a semiconductor substrate;
- and a coating mixture comprised of adhesion promoter and photopolymer the semiconductor substrate, the adhesion promoter containing α-amino propyltriethoxysilane in organic solution.
Dependencies are inferred from the claim text.