Method of forming a metal gate structure with tuning of work function by silicon incorporation
AssigneeAdvanced Micro Devices, Inc.
InventorsChristy Woo, Paul Besser, Minh van Ngo, James Pan, Jinsong Yin
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AssigneeAdvanced Micro Devices, Inc.
InventorsChristy Woo, Paul Besser, Minh van Ngo, James Pan, Jinsong Yin
Estimating the term…
A method for forming a semiconductor structure having a metal gate with a controlled work function includes the step of forming a precursor having a substrate with active regions separated by a channel, a temporary gate over the channel and within a dielectric layer. The temporary gate is removed to form a recess with a bottom and sidewalls in the dielectric layer. A non-silicon containing metal layer is deposited in the recess. Silicon is incorporated into the metal layer and a metal is deposited on the metal layer. The incorporation of the silicon is achieved by silane treatments that are performed before, after or both before and after the depositing of the metal layer. The amount of silicon incorporated into the metal layer controls the work function of the metal gate that is formed.
A method of forming a semiconductor structure comprising the steps of forming a precursor having a substrate with active regions separated by a channel, and a temporary gate over the channel and within a dielectric layer:
Dependencies are inferred from the claim text.