Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Abstract

A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a curable component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the curable component of the hybrid adhesive material may be cured to more permanently secure the semiconductor device components to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200° C. and as low as about 120° C. or less.

Dependencies are inferred from the claim text.