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US 7,071,033 B2Granted
Method for forming semiconductor device including stacked dies
AssigneeFairchild Semiconductor Corporation
InventorMaria Cristina B. Estacio
Life of this patent
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Abstract
A semiconductor device including a leadframe and two stacked dies, a first of which is on a top surface of a leadframe while the second one is on a bottom surface of the leadframe. The drain region of the first die is coupled to a drain clip assembly that includes a drain clip that is in contact with a lead rail. The body of the semiconductor device includes a window or opening that exposes the drain region of the second die.
Claims8
A method comprising:
- providing a leadframe including a plurality of leads, a first source attach area on a first surface of the leadframe and a first gate attach area, and a second source attach area on a second surface of the leadframe and a second gate attach area;
- attaching at least two dies to the leadframe, a first die being electrically coupled to the first source and gate attach areas of the leadframe and a second die being electrically coupled to the second source and gate attach areas of the leadframe;
- attaching a drain connection assembly to a drain region of the first die;
- and,
- forming a body around at least a portion of the first die and the second die, such that at least a drain region of the second die is exposed by the body,
- wherein the first and second dies are in a stacked relationship and are at opposite sides of the leadframe, and wherein the drain region of the first die faces away from the leadframe and the drain region of the second die faces away from the leadframe.
3 more elements
A method of making a semiconductor device, the method comprising:
- providing a leadframe including a plurality of leads extending therefrom, a first source attach area on a first surface of the leadframe and a first gate attach area, and a second source attach area on a second surface of the leadframe and a second gate attach area;
- bonding a first die to the first source and gate attach areas with solder;
- reflowing the solder;
- bonding a second die to the second source and gate attach areas with second solder;
- bonding a drain connection assembly to a drain region of the second die with third solder;
- reflowing at least the third solder;
- and
- coupling a body to the semiconductor device such that a drain region of the second die is exposed.
5 more elements
Dependencies are inferred from the claim text.