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US 7,071,030 B2Granted
Method of making a flexible substrate with a filler material
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Edward Schrock
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AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Edward Schrock
Estimating the term…
A method of adding a thermally conductive, electrically nonconductive filler to a flexible substrate such as a polyimide core. The substrate may be used, for example, as a part of a polyimide core for a tape or an interposer in a BGA or similar integrated circuit package. The resulting substrate has a higher thermal conductivity as compared to conventional substrates without fillers, thereby increasing the thermal dissipation through the substrate and enabling the device to cool more efficiently. The filler also reduces the coefficient of thermal expansion of the substrate to more closely match the die and reduce stresses. Furthermore, the filler increases the rigidity of the substrate, thereby enabling the device to be handled and carried more easily, for example, without a metal frame carrier.
A method of increasing the thermal conductivity of a flexible tape comprising, adding a thermally conductive filler material to a polyimide film, wherein the filler material increases the thermal conductivity of the tape by about 50% or more as compared to that of the polyimide film without the filler material.
A method of increasing the thermal conductivity of a flexible tape comprising, adding a filler material of thermally conductive material to a polyimide film prior to film formation, wherein the filler material is added in an extrusion method.
A method of increasing the thermal conductivity of a flexible tape comprising, adding a filler material of thermally conductive material to a polyimide film prior to film formation, wherein the filler material is added in a coating method.
A method of increasing the thermal conductivity of a flexible tape comprising, adding a filler material of thermally conductive material to a polyimide film, wherein the filler material is a nitride material.
A method of increasing the thermal conductivity of a flexible tape comprising, adding a filler material of thermally conductive material to a polyimide film, wherein the filler material reduces the CTE of the polyimide film by about 10% or more as compared to the polyimide film without the filler material.
A method of increasing the thermal conductivity of a flexible tape comprising, adding a thermally conductive filler material to a polyimide film, wherein the filler material increases the modulus of elasticity of the polyimide film as compared to the modulus of elasticity of the polyimide film without the filler material.
A method of increasing the thermal conductivity of a flexible tape for use in an integrated circuit, comprising adding a filler of thermally conductive material to a polyimide film, wherein the filler is a nitride.
A method of increasing the thermal conductivity of a flexible tape for use in an integrated circuit, comprising adding a thermally conductive filler material to a polyimide film, wherein the filler material is alumina.
A method of increasing the thermal conductivity of a flexible tape for use in an integrated circuit, comprising adding a thermally conductive filler material to a polyimide film, wherein the filler material is silica.
Dependencies are inferred from the claim text.