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US 7,071,011 B2Granted
Method of defect review
AssigneePowerchip Semiconductor Corp.
InventorLong-Hui Lin
Life of this patent
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Abstract
A method of defect review. First, a wafer with a plurality of defects is provided. A defect inspection is performed to detect the defects. An automatic defect classification is then performed to divide the defects into different defect types according to a predetermined database. A defect review is performed to review different defect types of defects which are sampled in different weights according to yield killing ratios of each defect types.
Claims9
A method of defect review comprising following steps:
- providing a wafer with a plurality of defects;
- performing a defect inspection to detect the defects;
- performing an automatic defect classification according to a database to separate the defects into a plurality of defect types;
- adjusting sampling ratios according to an influence degree each defect type has on process yield;
- and
- performing a defect review using the adjusted sampling ratios.
3 more elements
Dependencies are inferred from the claim text.