Substrate having character/symbol section and processing method of character/symbol section
AssigneeDai Nippon Printing Co., Ltd.
InventorsShigekazu Fujimoto, Masaaki Kurihara
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Abstract
The present invention provides a substrate-engraving-type chromeless phase-shift mask enabling to adopt a manufacturing method which poses no problem in quality, gives a high operating efficiency, and permits arrangement of characters and symbols, and a manufacturing method thereof. The substrate of the invention has a character/symbol section, on a surface of a transparent substrate, comprising characters and/or symbols engraved in the form of a slit-shaped or lattice-shaped pattern comprising concave grooves only in a prescribed portion corresponding to the characters and/or symbols.
Claims2
A processing method of a character/symbol section in a substrate having the character/symbol section to be recognized as a character, symbol or both in addition to a phase-shift section on a surface of the same substrate, wherein said substrate having the character/symbol section is a chromeless phase-shift mask having no substrate-engraving-type light shielding layer or a phase mask for fiber Bragg grating fabrication, and said resist arranging step is conducted by simultaneously carrying out, after providing a light shielding film over an entire surface of the transparent substrate and arranging an electron-beam-sensitive resist over said entire surface of the light shielding film, a step for forming the character/symbol section and a step for forming the shifter section, comprising
- (A) a resist image forming sub-step of selectively exposing the resist to electron beam, and developing the resist, thereby forming a resist image opening at portions for forming the character/symbol section and a portion for forming a shifter section;
- (B) an etching sub-step of etching a light shielding film opening at portions for forming the character/symbol section and a portion for forming the shifter section;
- (C) a substrate engraving sub-step of engraving the portions of the substrate exposed from the openings of the resist and the light shielding film by etching;
- and
- (D) a sub-step of removing remaining resist and light shielding film.
Dependencies are inferred from the claim text.