Water-cooling heat dissipation system
AssigneesWaffer Technology Corp., Jack Wang
InventorsJack Wang, Cheng-Hua Cheng, Michael Lin, Charles Ma
Life of this patent
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Abstract
A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.
Claims7
A water-cooling heat dissipation system used to dissipate heat generated by an electronic device, comprising:
- a heat sink, mounted on the electronic device, the heat sink having a circulating loop connected to two ends of the heat sink;
- a first cooling base installed in the circulating loop at an outlet of the heat sink;
- a second cooling base installed in the circulating loop at an inlet of the heat sink, the second cooling base having a cryogenic chip to cool down water flowing therethrough into icy state;
- and
- a water pump installed in the ciruclating loop between the first and the second cooling base.
Dependencies are inferred from the claim text.