Method for electrically connecting a semiconductor component to an electrical subassembly

A method for establishing an electrical connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module comprising:

• providing a metal strip grid having internal terminal ends and external terminal ends that are electrically connected to the internal terminal ends by at least two metal strip conductors;
• joining the semiconductor component and the metal strip grid, wherein the semiconductor component includes an unhoused semiconductor chip which has electric terminals formed by metallized contact areas, such that at least two electric terminals of the semiconductor component are positioned on corresponding internal terminal ends so that a slip-proof mounting of the semiconductor component on the two internal terminal ends occurs;
• establishing an electrical connection between the electrical terminals of the semiconductor component and the internal terminal ends by the mounting;
• wherein the metal strip grid before being joined to the semiconductor component has been connected on at least one side in at least one partial area to a material that is not electrically conductive, wherein the metal strip grid includes a punched grid surrounded on both sides in at least part of the partial area by electrically nonconducting material, the electrically nonconducting material forming a contact frame that establishes the connection and fixation of the at least two metal strip conductors forming the conductors relative to one another;
• introducing a metallic body that functions as a heat sink into an electrically nonconducting housing;
• covering the semiconductor component on a bottom side with an electrically conductive bonding material;
• positioning the semiconductor component on the metallic body;
• covering one of the electric terminals on the top side of the semiconductor component and the internal terminal ends of the punched grid with one of the electrically conducting bonding material and another electrically conducting bonding material;
• positioning the punched grid to lie with the external terminal ends on terminal areas of the additional parts of the electric module at a same time;
• and
• mounting the external terminal ends to the terminal areas simultaneously.