Protection structure for thermal conducting medium of heat dissipation device
AssigneeCpumate Inc.
InventorsChi-Lin Chang, Hui-Min Tsui
Life of this patent
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Abstract
A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The protection structure has a bottom surface to cover the thermal conducting medium, a side wall extending along and projecting from a periphery of the bottom surface to form a space for receiving the thermal conducting medium and a portion of the heat dissipation device, and a support structure protruding from the bottom surface to avoid a direct contact between the thermal conducting medium and the bottom surface.
Claims14
A protection structure for a thermal conducting medium of a heat dissipation device, comprising:
- a bottom surface, being substantially flat to cover the thermal conducting medium;
- a side wall extending along and projecting from a periphery of the bottom surface to form a space for receiving the thermal conducting medium and a portion of the heat dissipation device;
- and
- a dented support structure formed in and protruding from the bottom surface to contact on the heat dissipation device so as to avoid a direct contact between the thermal conducting medium and the bottom surface.
Dependencies are inferred from the claim text.