High-density architecture for a microelectronic complex on a planar body

A microelectronic complex comprising:

• a) a first body including a planar main surface, said planar main surface defining an attachment site;
• b) a discrete functional module including a second body containing an integrated circuit, said second body including a pair of main faces and a side surface between said pair of main faces, said discrete functional module being affixed to said first body at said attachment site whereby said first and second bodies are maintained in a predetermined spatial relationship in which the side surface of said second body faces the planar main surface of said first body;
• c) an interconnection module allowing to transport signals between said first body and the integrated circuit of said second body, wherein said interconnection module includes a plurality of signal transmissive paths, said discrete functional module including a plurality of contact pads on said second body for receiving the signal transmissive paths of said interconnection module, said contact pads allowing signals to be exchanged between the integrated circuit of said second body and said first body via the signal conducting members.

A microelectronic complex comprising:

• a) a first body including a planar main surface, said planar main surface defining an attachment site;
• b) a plurality of discrete functional modules arranged on said first body, each discrete functional module including a second body containing an integrated circuit, said second body including a pair of main faces and a side surface between said pair of main faces, said plurality of discrete functional modules being affixed to said first body at said attachment site whereby said second bodies are maintained in a predetermined spatial relationship with said first body in which the side surfaces of said second bodies face the planar main surface of said first body, the arrangement of said plurality of discrete functional modules on said first body realizes a cooling system for said microelectronic complex, wherein said cooling system includes a plurality of cooling fins for dissipating heat generated by said microelectronic complex, each cooling fin realized by one of said discrete functional modules;
• c) an interconnection module allowing to transport signals between said first body and the integrated circuits of said second bodies.