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US 7,067,913 B2Granted
Semiconductor cooling system and process for manufacturing the same
AssigneeDtnr Ltd.
InventorsEliezer Adar, Vladimir Gotlib
Life of this patent
Estimating the term…
Abstract
A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
Claims40
A cooling device comprising:
- an element to be cooled and including a surface outputting heat;
- a first metallic filler layer configured to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- a first metal plate covering and in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- a second metallic filler layer in thermal conductive contact with said first metal plate;
- and
- a semiconductor thermoelectric module in thermal conductive contact with said second metallic filler layer.
3 more elements
A cooling device comprising:
- an element to be cooled and including a surface outputting heat;
- a first metallic filler layer configured to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- a first metal plate covering and in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- wherein said first metallic filler layer is formed of an alloy of:
- Sn
- 21.1%,
- Bi
- 50%,
- Pb
- 20.5%, and
- Cd
- 8.4%.
9 more elements
A cooling device comprising:
- an element to be cooled and including a surface outputting heat;
- a first metallic filler layer configured to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- a first metal plate covering and in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- wherein said first metallic filler layer is formed of an alloy of:
- Sn
- 12.5%,
- Bi
- 50%,
- Pb
- 25%, and
- Cd
- 12.5%.
9 more elements
A cooling device comprising:
- an element to be cooled and including a surface outputting heat;
- a first metallic filler layer configured to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- a first metal plate covering and in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- wherein said first metallic filler layer is formed of an alloy of:
- Sn
- 12.9%,
- Bi
- 49.4%,
- Pb
- 27.7%, and
- Cd
- 10%.
9 more elements
A process for manufacturing a cooling device comprising:
- providing an element to be cooled and including a surface outputting heat;
- providing a first metallic filler layer to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- providing a first metal plate to cover and to be in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- providing a second metallic filler layer in thermal conductive contact with said first metal plate;
- and
- providing a semiconductor thermoelectric module in thermal conductive contact with said second metallic filler layer.
3 more elements
A process for manufacturing a cooling device comprising:
- providing an element to be cooled and including a surface outputting heat;
- providing a first metallic filler layer to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- providing a first metal plate to cover and to be in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- wherein said first metallic filler layer is formed of an alloy of
- Sn
- 21.1%,
- Bi
- 50%,
- Pb
- 20.5%, and
- Cd
- 8.4%.
9 more elements
A process for manufacturing a cooling device comprising:
- providing an element to be cooled and including a surface outputting heat;
- providing a first metallic filler layer to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- providing a first metal plate to cover and to be in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- wherein said first metallic filler layer is formed of an alloy of
- Sn
- 12.5%,
- Bi
- 50%,
- Pb
- 25%, and
- Cd
- 12.5%.
9 more elements
A process for manufacturing a cooling device comprising:
- providing an element to be cooled and including a surface outputting heat;
- providing a first metallic filler layer to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- providing a first metal plate to cover and to be in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer;
- wherein said first metallic filler layer is formed of an alloy of
- Sn
- 12.9%,
- Bi
- 49.4%,
- Pb
- 27.7%, and
- Cd
- 10%.
9 more elements
Dependencies are inferred from the claim text.