Packaged microelectronic devices including first and second casings

A packaged microelectronic device, comprising:

• a die comprising integrated circuitry;
• a first molded casing covering at least a portion of the die, the first casing having a plurality of first coupling elements;
• a heat dissipation unit attached directly to one of the die and the first casing to dissipate heat generated by the integrated circuitry;
• and
• a second molded casing in physical contact with at least a portion of the heat dissipation unit and at least a portion of the first casing, the second casing having a plurality second coupling elements interconnected with corresponding first coupling elements of the first casing;
• wherein the first coupling elements are defined by first ridges extending across an outer surface of the first casing wherein the heat dissipation unit has a plurality of elongated slots through which the first ridges of the first casing extend, wherein a portion of the first ridges project beyond the heat dissipation unit;
• and
• wherein the second casing has mating elements that receive the first ridges of the first casing.

A packaged microelectronic device, comprising:

• a die comprising integrated circuitry;
• a first molded casing covering at least a portion of the die, the first casing having a plurality of first coupling elements;
• a heat dissipation unit carried by one of the die and the first casing to dissipate heat generated by the integrated circuitry;
• and
• a second molded casing encapsulating at least a portion of the heat dissipation unit and at least a portion of the first casing, the second casing having a plurality second coupling elements interconnected with corresponding first coupling elements of the first casing;
• wherein the die is attached to a distribution member having a plurality of contacts coupled to integrated circuitry of the die;
• wherein the first casing has coupling elements defined by first ridges extending across an outer surface of the first casing;
• wherein the heat dissipation unit has a plurality of elongated slots through which the first ridges of the first casing extend, wherein a portion of the first ridges project beyond the heat dissipation unit;
• and
• wherein the second casing has mating elements that receive the portions of the first ridges that project beyond the heat dissipation unit.

A packaged microelectronic device, comprising:

• a semiconductor die comprising integrated circuitry and a plurality of bond-pads forming a memory device;
• a distribution member having a plurality of contacts electrically coupled to the bond-pads;
• a first casing enclosing at least a portion of the die, wherein the first casing comprises an outer surface and a plurality of engagement elements projecting from the outer surface and/or formed in the outer surface;
• a heat dissipation unit attached directly to the die, the distribution member, and/or the first casing, the heat dissipation unit including a plurality of flanges, wherein at least a portion of the flanges are exposed to an outside environment;
• and
• a second casing in the physical contact with the heat dissipation unit and enclosing at least a portion of the first casing, the second casing engaging the engagement elements of the first casing.

A packaged microelectronic device, comprising:

• a semiconductor die comprising integrated circuitry and a plurality of bond-pads forming a memory device;
• a distribution member having a plurality of contacts electrically coupled to the bond-pads;
• a first casing enclosing at least a portion of the die, wherein the first casing comprises a plurality of engagement elements on an outer surface;
• and
• a second casing enclosing at least a portion of the first casing, the second casing engaging the engagement element of the first casing;
• wherein the die is attached to a distribution member having a plurality of contacts coupled to integrated circuitry of the die;
• wherein the first casing has engagement elements defined by first ridges extending across an outer surface of the first casing;
• wherein the packaged device further comprises a heat dissipation unit having a plurality of elongated slots through which the first ridges of the first casing extend, wherein a portion of the first ridges project beyond the heat dissipation unit;
• and
• wherein the second casing has mating elements that receive the portions of the first ridges that project beyond the heat dissipation unit.

A packaged microelectronic device, comprising:

• a die comprising integrated circuitry;
• a first casing coating at least a portion of the die, the first casing having an outer surface and a plurality of interconnect elements projecting from the outer surface and/or formed in the outer surface;
• a heat sink proximate to the die, wherein the heat sink includes a plurality of receiving members that receive at least a portion of the interconnect elements of the first casing;
• and
• a second casing in physical contact with at least a portion of the heat sink and coating at least a portion of the first casing, the second casing engaging the interconnect elements of the first casing.