Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsMasaaki Hatano, Hiroshi Ikegami, Takamasa Usui, Mie Matsuo
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Abstract
A semiconductor device comprising a substrate, a plurality of dielectric films formed on the substrate, laid one upon another, and a fuse interconnect-wire formed above the substrate and covered with a predetermined one of the dielectric films, and including a fuse main body which is to be blown to electrically disconnect the fuse interconnect-wire, which is smaller than a bottom of a fuse-blowing recess made in the predetermined dielectric film, which has a length not less than the diameter of a fuse-blowing laser beam and which opposes the bottom of the fuse-blowing recess.
Claims20
A semiconductor device comprising:
- a substrate;
- a plurality of dielectric films formed on the substrate, laid one upon another;
- and
- a fuse interconnect-wire formed above the substrate and covered with a predetermined one of the dielectric films, and including a fuse main body which is to be blown to electrically disconnect the fuse interconnect-wire, which is smaller than a bottom of a fuse-blowing recess made in the predetermined dielectric film, which has a length more than the diameter of a fuse-blowing laser beam and which opposes the bottom of the fuse-blowing recess.
A semiconductor device comprising:
- a plurality of dielectric films formed on a substrate, laid one upon another;
- and
- a fuse interconnect-wire which is formed above the substrate and covered with a predetermined one of the dielectric films, and which comprises a fuse lead and a fuse main body electrically connected to the fuse lead, the fuse main body lying below a bottom of a fuse-blowing recess made in the predetermined dielectric film and above the fuse lead, having a length more than the diameter of a fuse-blowing laser beam, and having both ends within an area opposite the bottom of the fuse-blowing recess, said both ends being spaced apart in the lengthwise direction of the fuse main body.
A semiconductor device comprising:
- a plurality of dielectric films formed on a substrate, one laid upon another;
- and
- a fuse interconnect-wire which is formed above the substrate and covered with a predetermined one of the dielectric films, and which comprises a fuse lead and a fuse main body electrically connected to the fuse lead, the fuse main body lying below a bottom of a fuse-blowing recess formed in the predetermined dielectric film, being provided in the same layer as the fuse lead, having a length more than the diameter of a fuse-blowing laser beam and a width not less than that of the fuse lead, and having both ends within an area opposite the bottom of the fuse-blowing recess, said both ends being spaced apart in the lengthwise direction of the fuse main body.
Dependencies are inferred from the claim text.