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US 7,067,393 B2Granted
Substrate assembly for stressed systems
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsFabrice Letertre, Bruno Ghyselen, Olivier Rayssac
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Abstract
A substrate-assembly having a mechanical stress absorption system. The assembly includes two substrates, one of which has a mechanical stress absorbing system, such as a plurality of motifs that absorb thermoelastic stresses, to prevent cracking or destruction of the substrates or separation of one substrate from the other.
Claims26
A method of fabricating a substrate-assembly having a mechanical stress absorption system comprising the steps of:
- providing each of first and second substrates with a bonding surface;
- providing a mechanical stress absorption system on the second substrate on a surface opposite the bonding surface;
- bonding the bonding surfaces of the first and second substrates to form an initial substrate assembly with the mechanical stress absorbing system being exposed;
- and
- removing the mechanical stress absorbing system from the second substrate to form a final substrate assembly;
- wherein the first substrate has a thermal expansion coefficient that is different than that of the second substrate and the mechanical stress absorption system absorbs thermoelastic stresses caused by exposure of the initial assembly to heating and cooling.
3 more elements
Dependencies are inferred from the claim text.