Package having bond-sealed underbump
AssigneeHewlett-Packard Development Company, L.P.
InventorsCharles C. Haluzak, Martha A. Truninger, Donald L. Michael
Life of this patent
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Abstract
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
Claims13
A method for fabricating an electronic device package structure comprising the steps of:
- establishing an underbump on a first substrate wafer, the underbump composed of a localized bond region and standoff material having a face distal to the first substrate wafer, the localized bond region deposited on the distal face of the standoff material;
- preparing at least one breach cut in the underbump;
- and
- then adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein;
- wherein the breach cut extends from an exterior surface of the underbump to the chamber.
A method for fabricating an electronic device package structure comprising the steps of:
- establishing a standoff material on a first substrate wafer;
- establishing an adhesion layer over the standoff material, wherein the adhesion layer is selected from tantalum, a tantalum-containing compound, and combinations thereof;
- then depositing at least one bond material lever over the adhesion layer, thereby forming a stack, wherein the at least one bond material layer includes at least one layer containing tin and at least one layer containing gold;
- configuring the stack into an underbump by:
- masking the stack with at least one resist material;
- sequentially etching the adhesion layer and the at least one bond material layer into an underbump pattern;
- masking the standoff material after the at least one bond material layer has been etched;
- and
- etching the standoff material into the underbump pattern;
- and
- adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein.
A method for fabricating an electronic device package structure comprising the steps of:
- establishing a standoff material on a first substrate wafer;
- depositing at least one bond material layer over the standoff material, thereby forming a stack;
- configuring the stack into an underbump by:
- masking the stack with at least one resist material;
- etching the at least one bond material layer into an underbump pattern;
- masking the standoff material after the at least one bond material layer has been etched;
- and
- etching the standoff material into the underbump pattern;
- and
- adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein.
A method for fabricating an electronic device package structure comprising the steps of:
- establishing an underbump on a first substrate wafer, the underbump composed of a localized bond region deposited in overlying relationship to a standoff material;
- adhering the first substrate wafer having the underbump positioned thereon to a second substrate wafer, thereby defining a chamber adapted to contain the electronic device therein;
- depositing a protective layer on the first substrate wafer, the protective layer positioned on a face of the first substrate wafer opposed to the underbump, the protective layer deposited prior to establishing the underbump;
- removing the protective layer subsequent to establishing the underbump;
- and
- depositing an anti-reflective coating an the face of the first substrate wafer after removing the protective layer.
Dependencies are inferred from the claim text.