Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method
AssigneeHitachi Chemical Company, Ltd.
InventorsNoriyo Kimura, Tomoaki Aoki, Kenji Kamio, Masaki Endou
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and/or has a dispersity of 2.5-6.0, and wherein the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one C3-C6 alkylene glycol chain.
Claims47
A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one alkylene glycol chain selected from the group consisting of C3-C6 alkylene glycol chains.
A photosensitive resin composition of the invention comprising (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) has a dispersity of 2.5-6.0 and the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one alkylene glycol chain selected from the group consisting of C3-C6 alkylene glycol chains.
Dependencies are inferred from the claim text.