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US 7,067,226 B2Granted
Photosensitive film for circuit formation and process for producing printed wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasao Kubota, Takeshi Ohashi, Tatsuya Ichikawa
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Abstract
The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 μm; or a photosensitive layer having a thickness of 0.1 to 14 μm and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.
Claims14
A photosensitive film for circuit formation, comprising:
- a first film;
- a cushion layer comprising an ethylene/ethyl acrylate copolymer formed using ethylene as an essential copolymerizable monomer at a copolymerizing ratio of ethylene in the copolymerized monomers of 60 to 90%, by weight;
- and
- a photosensitive layer having a thickness of 3 to 10 μm on the first film, wherein the cushion layer is present between the first film and the photosensitive layer and the photosensitive layer comprises (A) a binder polymer that is a copolymer formed using a styrene or styrene derivative as an essential monomer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond, and (C) a photopolymerization initiator;
- and
- interlayer adhesion between the first film and the cushion layer is higher than interlayer adhesion between the cushion layer and the photosensitive layer.
3 more elements
Dependencies are inferred from the claim text.