Filling device

A filling system for filling vias in an electronic substrate, said filling system comprising:

• a source of pressurized fill material;
• a pressure head comprising:
• a main body;
• a pressure chamber with a plurality of fill material inlets coupled to the source of pressurized fill material by the fill material inlets, whereby fill material flows between the pressure chamber and the source of pressurized fill material, and between the pressure chamber and an electronic substrate;
• a wear element assembly detachably coupled to the main body the wear element assembly has an elongated fill material outlet and a contacting surface at least a portion of which contacts the electronic substrate during filling, the contacting surface having an area less than or equal to Y square inches where Y is one of 6.1, 6.65, 8.1, and 9.25;
• the fill material outlet being an orifice through which material flows when flowing between the pressure chamber and the electronic substrate to be filled;
• the fill material inlets being orifices through which fill material flows when flowing between the source of pressurized fill material and the pressure chamber;
• and
• a dispersing mechanism for dispersing fill material flowing into the pressure chamber from the plurality of inlets along the length of the fill material outlet.

A filling system for filling vias in an electronic substrate, said filling system comprising:

• a source of non-conductive pressurized fill material;
• a pressure head with a pressure chamber, a plurality of fill material inlets, and an elongated fill material outlet, coupled to the source of pressurized fill material by the fill material inlets, whereby fill material flows between the pressure chamber and the source of pressurized fill material, and between the pressure chamber and an electronic substrate;
• a flow equalization grid dividing the pressure chamber into at least two parts and positioned between the plurality of fill material inlets and the fill material outlet;
• the fill material inlets being orifices through which fill material flows when flowing between the source of pressurized fill material and the pressure chamber;
• the fill material outlet being orifices through which fill material flows when flowing between the pressure chamber and the electronic substrate to be filled;
• and
• a dispersing mechanism for dispersing fill material flowing into the pressure chamber from the plurality of inlets along the length of the fill material outlet.

A filling system for filling vias in an electronic substrate, said filling system comprising:

• a source of pressurized fill material;
• a pressure bead with a pressure chamber, a plurality of fill material inlets, and an elongated fill material outlet further and an ultrasonic driver, coupled to the source of pressurized fill material by the fill material inlets, whereby fill material flows between the pressure chamber and the source of pressurized fill material, and between the pressure chamber and an electronic substrate;
• the fill material inlets being orifices through which fill material flows when flowing between the source of pressurized fill material and the pressure chamber;
• the fill material outlet being an orifice through which fill material flows when flowing between the pressure chamber and the electronic substrate to be filled;
• and
• a dispersing mechanism for dispersing fill material flowing into the press chamber from the plurality of inlets along the length of the fill material outlet.

A filling system for filling vias in an electronic substrate, said filling system comprising:

• a source of pressurized fill material;
• a pressure head with a pressure chamber, a plurality of fill material inlets, and an elongated fill material outlet, coupled to the source of pressurized fill material by fill material inlets, whereby fill material flows between the pressure chamber and the source of pressurized fill material, and between the pressure chamber and an electronic substrate;
• wherein the total time required to fill all of the vias of the electronic substrate to be filled is less than T seconds wherein T is one of 20, 30, 40, and 50;
• the fill material inlets being orifices through which fill material flows when flowing between the source of pressurized fill material and the pressure chamber:
• the fill material, outlet being an orifice through which fill material flows when flowing between the pressure chamber and the electronic substrate to be filled;
• and
• a dispersing mechanism for dispersing fill material flowing into the pressure chamber from the plurality of inlets along the length of the fill material outlet.

A filling system for filling vias in an electronic substrate, said filling system comprising:

• a source of pressurized fill material;
• wherein the source of pressurized fill material provides fill material at a pressure of less than L pounds per square inch where L is one of 80, 50, 25, 20, 15, and 10;
• a pressure bead with a pressure chamber, a plurality of fill material inlets, and an elongated fill material outlet, coupled to the source of pressurized fill material by the fill material inlets, whereby fill material flows between the pressure chamber and the source of pressurized fill material, and between the pressure chamber and an electronic substrate;
• the fill material inlets being orifices through which fill material flows when flowing between the source of pressurized fill material and the pressure chamber;
• the fill material outlet being an orifice through which fill material flows when flowing between the pressure chamber and the electronic substrate to be filled;
• and
• a dispersing mechanism for dispersing fill material flowing into the pressure chamber from the plurality of inlets along the length of the fill material outlet.

A filling system for filling vias of a substantially planar dielectric substrate, said filling system comprising:

• a source of pressurized non- conductive fill material;
• and
• a pressure head comprising:
• a main body comprising a pressure chamber and a fill material feed tube within the pressure chamber, the feed tube comprising a plurality of fill material inlets;
• a detachable wear element assembly comprising a plurality of elongated fill material outlets, a flow equalization grid, a gasket comprising a substrate contacting portion, and a gasket supporting member coupling the gasket to the main body;
• an ultrasonic driver;
• wherein:
• fill material flows between the pressure chamber and the source of pressurized fill material, and between the pressure chamber and an electronic substrate to be filled;
• all of the fill material inlets of the plurality of fill material inlets are orifices through which fill material flows when flowing between the source of pressurized fill material and the pressure chamber, and the fill material inlets are directed towards a wall of the pressure chamber and away from the fill material outlet;
• all of the fill material outlets of the plurality of fill material outlets are orifices through which fill material flows when flowing between the pressure chamber and the substrate be filled;
• the combined area of all the fill material inlets of the plurality of fill material inlets is less than one half of the combined area of all the fill material outlets of the plurality of fill material outlets;
• the substrate contacting portion of the gasket contacts the electronic substrate during filling and the substrate contacting portion has an area less than or equal to 9 square inches;
• the flow equalization grid divides the pressure chamber into at least two parts and is positioned near the plurality of fill material outlets and between the plurality of fill material inlets and the plurality of fill material outlets, the flow equalization grid comprises a plurality of holes passing through the grid, and the plurality of holes comprising less than 75% of the area of the fill material outlet;
• the total time required to fill all of the visa of the electronic substrate to be filled is less than 30 seconds;
• and
• the source of pressurized fill material provides fill material at a pressure of between 8 and 16 pounds per square inch.