Pattern correction method of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsSachiko Kobayashi, Toshiya Kotani, Satoshi Tanaka, Susumu Watanabe, Mitsuhiro Yano
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AssigneeKabushiki Kaisha Toshiba
InventorsSachiko Kobayashi, Toshiya Kotani, Satoshi Tanaka, Susumu Watanabe, Mitsuhiro Yano
Estimating the term…
A pattern correction method executed by a computer includes a first correction and a second correction. The first correction is executed by calculating a correction value, in consideration for an optical proximity effect, for edges (first edges) meeting a condition among the edges constituting a designed pattern. Subsequently, The second correction is executed for an edge (second edge) which does not meet the condition, by use of the correction value of any one of the edges (first edges) adjacent to the second edge among the first edges for which the first correction is executed, thus connecting the corrected first edge and the corrected second edge by a line segment. The pattern is corrected to a shape suitable for a mask drawing and a check with simple processing.
A pattern correction method executed by a computer the method comprising:
A pattern correction method executed by a computer, the method comprising:
A pattern correction method executed by a computer, the method comprising:
A pattern correction method executed by a computer, the method comprising:
A computer program product configured to be executed by a computer, the program product comprising:
Dependencies are inferred from the claim text.